Achkir, B.: search on Z-Library

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1

Modeling and Measurement of Ground Bounce Induced by High-Speed Output Buffer With On-Chip Low-Dropout (LDO) Regulator

Kim, Heegon, Cho, Jonghyun, Achkir, Brice, Fan, Jun

Journal:

IEEE Transactions on Electromagnetic Compatibility

Year:

2018

Language:

english

File:

PDF, 528 KB

english, 2018

2

Decoupling capacitor power ground via layout analysis for multi-layered PCB PDNs

Zhao, Biyao, Liang, Shuang, Connor, Samuel, Cocchini, Matteo, Achkir, Brice, Ruehli, Albert, Archambeault, Bruce, Fan, Jun, Drewniak, James

Journal:

Electromagnetic Compatibility Magazine, IEEE

Year:

2020

File:

PDF, 1.65 MB

2020

3

Modeling and Analysis of On-Chip Power Noise Induced by an On-Chip Linear Voltage Regulator Module With a High-Speed Output Buffer

Kim, Heegon, Cho, Jonghyun, Yoon, Changwook, Achkir, Brice, Drewniak, James, Fan, Jun

Journal:

IEEE Transactions on Electromagnetic Compatibility

Year:

2019

Language:

english

File:

PDF, 54 KB

english, 2019

4

[IEEE 2016 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC) - Shenzhen, China (2016.5.17-2016.5.21)] 2016 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC) - Transient simulation for power integrity using physics based circuit modeling

Zhao, B., Huang, C., Shringarpure, K., Bai, S., Makharashvili, T., Cao, Y. S., Achkir, B., Cracraft, M., Cocchini, M., Connor, S., Archambeault, B., Jiang, L., Ruehli, A., Fan, J., Drewniak, J.

Year:

2016

Language:

english

File:

PDF, 1.73 MB

english, 2016

5

[IEEE 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI) - New Orleans, LA, USA (2019.7.22-2019.7.26)] 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI) - Equivalent Inductance Analysis and Quantification for PCB PDN Design

Ding, Yifan, Zhao, Biyao, Liang, Shuang, Bai, Siqi, Connor, Samuel, Cocchini, Matteo, Achkir, Brice, Scearce, Stephen, Li, Erping, Archambeault, B., Fan, Jun, Drewniak, James

Year:

2019

Language:

english

File:

PDF, 446 KB

english, 2019

6

[IEEE 2015 IEEE Symposium on Electromagnetic Compatibility and Signal Integrity - Santa Clara, CA, USA (2015.3.15-2015.3.21)] 2015 IEEE Symposium on Electromagnetic Compatibility and Signal Integrity - On-chip linear voltage regulator module (VRM) effect on power distribution network (PDN) noise and jitter at high-speed output buffer

Kim, Heegon, Kim, Sukjin, Kim, Joungho, Yoon, Changwook, Kim, Jingook, Achkir, Brice, Fan, Jun

Year:

2015

Language:

english

File:

PDF, 803 KB

english, 2015

7

[IEEE 2018 IEEE 22nd Workshop on Signal and Power Integrity (SPI) - Brest (2018.5.22-2018.5.25)] 2018 IEEE 22nd Workshop on Signal and Power Integrity (SPI) - Impact of chip and interposer PDN to eye diagram in high speed channels

de Paulis, Francesco, Zhao, Biyao, Piersanti, Stefano, Cho, Jonghyun, Cecchetti, Riccardo, Achkir, Brice, Orlandi, Antonio, Fan, Jun

Year:

2018

Language:

english

File:

PDF, 1.03 MB

english, 2018

8

[IEEE 2015 IEEE Symposium on Electromagnetic Compatibility and Signal Integrity - Santa Clara, CA, USA (2015.3.15-2015.3.21)] 2015 IEEE Symposium on Electromagnetic Compatibility and Signal Integrity - Analytical PDN voltage ripple calculation using simplified equivalent circuit model of PCB PDN

Zhao, Biyao, Huang, Chenxi, Shringarpure, Ketan, Fan, Jun, Archambeault, Bruce, Achkir, Brice, Connor, Samuel, Cracraft, Michael, Cocchini, Matteo, Ruehli, Albert, Drewniak, James

Year:

2015

Language:

english

File:

PDF, 889 KB

english, 2015

9

Active Tendon Control of Large Trusses

Preumont, A., Achkire, Y., Bossens, F.

Journal:

Year:

2000

Language:

english

File:

PDF, 453 KB

english, 2000

10

[IEEE 2011 IEEE International Symposium on Electromagnetic Compatibility - EMC 2011 - Long Beach, CA, USA (2011.08.14-2011.08.19)] 2011 IEEE International Symposium on Electromagnetic Compatibility - Analytical expressions for transfer function of supply voltage fluctuation to jitter at a single-ended buffer

Kim, Jingook, De, Soumya, Shringarpure, Ketan, Pan, Siming, Achkir, Brice, Fan, Jun, Drewniak, James L.

Year:

2011

Language:

english

File:

PDF, 662 KB

english, 2011

11

crystals from T to

Achkir, D., Poirier, M., Bonn, D. A., Liang, Ruixing, Hardy, W. N.

Journal:

Physical Review B

Year:

1993

Language:

english

File:

PDF, 211 KB

english, 1993

12

[IEEE 2014 IEEE International Symposium on Electromagnetic Compatibility - EMC 2014 - Raleigh, NC, USA (2014.8.4-2014.8.8)] 2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) - De-embedding techniques for transmission lines: An application to measurements of on-chip coplanar traces

Erickson, Nicholas, Fan, Jun, Gao, Xu, Achkir, Brice, Pan, Siming

Year:

2014

Language:

english

File:

PDF, 1.08 MB

english, 2014

13

[IEEE 2009 IEEE International Symposium on Electromagnetic Compatibility - EMC 2009 - Austin, TX, USA (2009.08.17-2009.08.21)] 2009 IEEE International Symposium on Electromagnetic Compatibility - Material parameter extraction using Time-Domain TRL (t-TRL) measurements

Rajagopal, Abhilash, Achkir, Brice, Koledintseva, Marina, Koul, Amendra, Drewniak, James

Year:

2009

Language:

english

File:

PDF, 329 KB

english, 2009

14

[IEEE 2012 IEEE International Symposium on Electromagnetic Compatibility - EMC 2012 - Pittsburgh, PA, USA (2012.08.6-2012.08.10)] 2012 IEEE International Symposium on Electromagnetic Compatibility - Fast admittance computation for TSV arrays

Liu, Dazhao, Pan, Siming, Achkir, Brice, Fan, Jun

Year:

2012

Language:

english

File:

PDF, 797 KB

english, 2012

15

[IEEE 2015 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC) - Taipei, Taiwan (2015.5.26-2015.5.29)] 2015 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC) - Effects of time-variant non-linear TSV parameters on transient analysis for signal integrity

Piersanti, S., de Paulis, F., Orlandi, A., Achkir, B., Fan, J.

Year:

2015

Language:

english

File:

PDF, 837 KB

english, 2015

16

[IEEE 2016 IEEE International Symposium on Electromagnetic Compatibility - EMC 2016 - Ottawa, ON, Canada (2016.7.25-2016.7.29)] 2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) - PAM4 signaling considerations for high-speed serial links

Dikhaminjia, N., He, J., Tsiklauri, M., Drewniak, J., Fan, J., Chada, A., Mutnury, B., Achkir, B.

Year:

2016

File:

PDF, 1.16 MB

2016

17

ACTIVE TENDON CONTROL OF CABLE-STAYED BRIDGES

ACHKIRE, Y., PREUMONT, A.

Journal:

Earthquake Engineering & Structural Dynamics

Year:

1996

Language:

english

File:

PDF, 847 KB

english, 1996

18

[IEEE 2013 IEEE International Symposium on Electromagnetic Compatibility - EMC 2013 - Denver, CO, USA (2013.08.5-2013.08.9)] 2013 IEEE International Symposium on Electromagnetic Compatibility - Optimization of power delivery network design for multiple supply voltages

Pan, Siming, Achkir, Brice

Year:

2013

Language:

english

File:

PDF, 1.49 MB

english, 2013

19

, where BEDT-TTF is bis(ethylenedithio)tetrathiafulvalene: Evidence for unconventional superconductivity

Achkir, D., Poirier, M., Bourbonnais, C., Quirion, G., Lenoir, C., Batail, P., Jérome, D.

Journal:

Physical Review B

Year:

1993

Language:

english

File:

PDF, 191 KB

english, 1993

20

)Br

Truong, K. D., Achkir, D., Jandl, S., Poirier, M.

Journal:

Physical Review B

Year:

1995

Language:

english

File:

PDF, 288 KB

english, 1995

21

[IEEE 2013 IEEE International Symposium on Electromagnetic Compatibility - EMC 2013 - Denver, CO, USA (2013.08.5-2013.08.9)] 2013 IEEE International Symposium on Electromagnetic Compatibility - Comparative study of transmission lines design for 2.5D silicon interposer

Pan, Siming, Achkir, Brice

Year:

2013

Language:

english

File:

PDF, 708 KB

english, 2013

22

Novel De-Embedding Methodology and Broadband Microprobe Measurement for Through-Silicon Via Pair in Silicon Interposer

Wang, Qian, Cho, Jonghyun, Erickson, Nicholas, Hwang, Chulsoon, De Paulis, Francesco, Piersanti, Stefano, Orlandi, Antonio, Achkir, Brice, Fan, Jun

Journal:

IEEE Transactions on Electromagnetic Compatibility

Year:

2017

Language:

english

File:

PDF, 1.07 MB

english, 2017

23

[IEEE 2010 IEEE International Symposium on Electromagnetic Compatibility - EMC 2010 - Fort Lauderdale, FL, USA (2010.07.25-2010.07.30)] 2010 IEEE International Symposium on Electromagnetic Compatibility - Stressed jitter analysis for physical link characterization

Radhakrishnan, Nitin, Achkir, Brice, Fan, Jun, Drewniak, James L.

Year:

2010

Language:

english

File:

PDF, 578 KB

english, 2010

24

Formulation and Network Model Reduction for Analysis of the Power Distribution Network in a Production-Level Multilayered Printed Circuit Board

Shringarpure, Ketan, Pan, Siming, Kim, Jingook, Fan, Jun, Achkir, Brice, Archambeault, Bruce, Drewniak, James L.

Journal:

IEEE Transactions on Electromagnetic Compatibility

Year:

2016

Language:

english

File:

PDF, 1.34 MB

english, 2016

25

[IEEE 2016 IEEE International Symposium on Electromagnetic Compatibility - EMC 2016 - Ottawa, ON, Canada (2016.7.25-2016.7.29)] 2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) - Modeling optimization of test patterns used in de-embedding method for through silicon via (TSV) measurement in silicon interposer

Wang, Qian, Erickson, Nicholas, Cho, Jonghyun, Hwang, Chulsoon, Fan, Jun, de Paulis, Francesco, Piersanti, Stefano, Orlandi, Antonio, Achkir, Brice

Year:

2016

File:

PDF, 1.31 MB

2016

26

[IEEE 2013 IEEE International Symposium on Electromagnetic Compatibility - EMC 2013 - Denver, CO, USA (2013.08.5-2013.08.9)] 2013 IEEE International Symposium on Electromagnetic Compatibility - De-embedding techniques for transmission lines: An exploration, review, and proposal

Erickson, Nicholas, Shringarpure, Ketan, Fan, Jun, Achkir, Brice, Pan, Siming, Hwang, Chulsoon

Year:

2013

Language:

english

File:

PDF, 1.01 MB

english, 2013

27

Capacitance Enhanced Through-Silicon Via for Power Distribution Networks in 3D ICs

Hwang, Chulsoon, Achkir, Brice, Fan, Jun

Journal:

IEEE Electron Device Letters

Year:

2016

Language:

english

File:

PDF, 664 KB

english, 2016

28

Active damping and flutter control of cable-stayed bridges

Y. Achkire, F. Bossens, A. Preumont

Journal:

Journal of Wind Engineering and Industrial Aerodynamics

Year:

1998

Language:

english

File:

PDF, 205 KB

english, 1998

29

Analytical Transfer Functions Relating Power and Ground Voltage Fluctuations to Jitter at a Single-Ended Full-Swing Buffer

Hwang, Chulsoon, Kim, Jingook, Achkir, Brice, Fan, Jun

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2013

Language:

english

File:

PDF, 1.17 MB

english, 2013

30

[IEEE 2014 IEEE International Symposium on Electromagnetic Compatibility - EMC 2014 - Raleigh, NC, USA (2014.8.4-2014.8.8)] 2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) - On-chip voltage regulator module (VRM) effect on power/ground noise and jitter at high-speed output buffer

Kim, Heegon, Achkir, Brice, Kim, Jingook, Yoon, Changwook, Fan, Jun

Year:

2014

Language:

english

File:

PDF, 1.00 MB

english, 2014

31

Eliashberg treatment of the microwave conductivity of niobium

Marsiglio, F., Carbotte, J. P., Akis, R., Achkir, D., Poirier, M.

Journal:

Physical Review B

Year:

1994

Language:

english

File:

PDF, 215 KB

english, 1994

32

Active Damping of Structures with Guy Cables

Preumont, A., Achkire, Y.

Journal:

Journal of Guidance Control and Dynamics

Year:

1997

Language:

english

File:

PDF, 257 KB

english, 1997

33

Sensitivity Analysis of a Circuit Model for Power Distribution Network in a Multilayered Printed Circuit Board

Shringarpure, Ketan, Pan, Siming, Kim, Jingook, Fan, Jun, Achkir, Brice, Archambeault, Bruce, Drewniak, James L.

Journal:

IEEE Transactions on Electromagnetic Compatibility

Year:

2017

Language:

english

File:

PDF, 2.69 MB

english, 2017

34

Modeling and Application of Multi-Port TSV Networks in 3-D IC

Yao, Wei, Pan, Siming, Achkir, Brice, Fan, Jun, He, Lei

Journal:

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems

Year:

2013

Language:

english

File:

PDF, 6.47 MB

english, 2013

35

[IEEE 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - Tempe, AZ, USA (2012.10.21-2012.10.24)] 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems - Power-bandwidth trade-off on TSV array in 3D IC and TSV-RDL junction design challenges

Yao, Wei, Shi, Feng, He, Lei, Pan, Siming, Achkir, Brice, Li, Li

Year:

2012

Language:

english

File:

PDF, 912 KB

english, 2012

36

SPIE Proceedings [SPIE Second International Conference on Vibration Measurements by Laser Techniques: Advances and Applications - Ancona, Italy (Monday 23 September 1996)] Second International Conference on Vibration Measurements by Laser Techniques: Advances and Applications - Optical measurement of cable and string vibration

Achkire, Y., Preumont, Andre J., Tomasini, Enrico P.

Year:

1996

Language:

english

File:

PDF, 378 KB

english, 1996

37

Revised L–2L Method for On-Chip De-Embedding

Erickson, Nicholas, Achkir, Brice, Fan, Jun

Journal:

IEEE Transactions on Electromagnetic Compatibility

Year:

2018

Language:

english

File:

PDF, 3.68 MB

english, 2018

38

TEM-Like Launch Geometries and Simplified De-embedding for Accurate Through Silicon Via Characterization

de Paulis, Francesco, Piersanti, Stefano, Wang, Qian, Cho, Jonghyun, Erickson, Nicholas, Achkir, Brice, Fan, Jun, Drewniak, James, Orlandi, Antonio

Journal:

IEEE Transactions on Instrumentation and Measurement

Year:

2017

Language:

english

File:

PDF, 2.20 MB

english, 2017

39

Optical Measurement of Cable and String Vibration

Achkire, Y., Preumont, A.

Journal:

Shock and Vibration

Year:

1998

Language:

english

File:

PDF, 1.42 MB

english, 1998

40

[OSA National Fiber Optic Engineers Conference - San Diego, California (2009..-..)] Optical Fiber Communication Conference and National Fiber Optic Engineers Conference - Employing Embedded Waveform Viewing Technology with EDC in 10Gb/s Optical Links

Balcioglu, Ahmet, Achkir, Brice

Year:

2009

Language:

english

File:

PDF, 593 KB

english, 2009

41

[IEEE 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) - Washington, DC, USA (2017.8.7-2017.8.11)] 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) - Investigation of statistical eye-diagram estimation method for HBM including ISI, X-talk, and power noise

Cho, Jonghyun, Kim, Heegon, Fan, Jun, Achkir, Brice

Year:

2017

Language:

english

File:

PDF, 580 KB

english, 2017

42

[IEEE 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI) - New Orleans, LA, USA (2019.7.22-2019.7.26)] 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI) - Equivalent Inductance Analysis and Quantification for PCB PDN Design

Ding, Yifan, Zhao, Biyao, Liang, Shuang, Bai, Siqi, Connor, Samuel, Cocchini, Matteo, Achkir, Brice, Scearce, Stephen, Li, Erping, Archambeault, B., Fan, Jun, Drewniak, James

Year:

2019

File:

PDF, 446 KB

2019

43

Raman and microwave surface impedance measurements in the organic superconductor κ-Et2Cu[N(CN)2]BrxCl1−x

K.P. Truong, B. Danilovic, D. Achkir, S. Jandl, M. Poirier

Journal:

Synthetic Metals

Year:

1997

Language:

english

File:

PDF, 237 KB

english, 1997

44

[IEEE 2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) - Honolulu, HI, USA (2016.12.14-2016.12.16)] 2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) - Design of on-chip linear voltage regulator module and measurement of power distribution network noise fluctuation at high-speed output buffer

Lee, Manho, Kim, Heegon, Kim, Sukjin, Kim, Joungho, Cho, Jonghyun, Yoon, Changwook, Achkir, Brice, Kim, Jingook, Fan, Jun

Year:

2016

Language:

english

File:

PDF, 1.04 MB

english, 2016

45

[IEEE 2008 IEEE International Test Conference - Santa Clara, CA (2008.10.28-2008.10.30)] 2008 IEEE International Test Conference - Parametric Testing of Optical Interfaces

Achkir, B., Zivny, P., Eklow, B.

Year:

2008

Language:

english

File:

PDF, 33 KB

english, 2008

46

[IEEE 2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Seoul, South Korea (2015.12.14-2015.12.16)] 2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Surface current distribution for PCB PDNGeometry

Zhao, Biyao, Bai, Siqi, Huang, Chenxi, Fan, Jun, Ruehli, Albert, Drewniak, James, Ye, Hanqin, Li, Erping, Achkir, Brice, Archambeault, Bruce, Connor, Samuel, Cracraft, Michael, Cocchini, Matteo

Year:

2015

Language:

english

File:

PDF, 533 KB

english, 2015

47

[IEEE 2016 IEEE/ACES International Conference on Wireless Information Technology and Systems (ICWITS) and Applied Computational Electromagnetics (ACES) - Honolulu, HI, USA (2016.3.13-2016.3.18)] 2016 IEEE/ACES International Conference on Wireless Information Technology and Systems (ICWITS) and Applied Computational Electromagnetics (ACES) - Inductance extraction for physics-based modeling of power net area fills with complex shapes and voids using the plane-pair PEEC method

Bai, Siqi, Huang, Chenxi, Zhao, Biyao, Fan, Jun, Rueli, Albert, Drewniak, James, Archambeault, Bruce, Connor, Samuel, Cracraft, Michael, Cocchini, Matteo, Achkir, Brice

Year:

2016

Language:

english

File:

PDF, 640 KB

english, 2016

48

On-chip linear voltage regulator module (VRM) effect on power distribution network (PDN) noise and jitter at high-speed output buffer

Kim, Heegon, Kim, Sukjin, Kim, Joungho, Yoon, Changwook, Achkir, Brice, Fan, Jun

Journal:

Electromagnetic Compatibility Magazine, IEEE

Year:

2015

Language:

english

File:

PDF, 2.24 MB

english, 2015

49

[IEEE 2014 IEEE 23rd Electrical Performance of Electronic Packaging and Systems (EPEPS) - Portland, OR, USA (2014.10.26-2014.10.29)] 2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems - Effectiveness analysis of de-embedding method for typical TSV pairs in a silicon interposer

Wang, Qian, Shringarpure, Ketan, Chen, Bichen, Fan, Jun, Hwang, Chulsoon, Pan, Siming, Achkir, Brice

Year:

2014

Language:

english

File:

PDF, 787 KB

english, 2014

50

Anisotropic flux flow studied by microwave surface impedance measurements in the organic superconductors κ-(BEDT-TTF)2Cu(NCS)2

Achkir, D., Poirier, M., Bourbonnais, C., Quirion, G., Batail, P., Lenoir, C., Jerome, D.

Journal:

Synthetic Metals

Year:

1993

Language:

english

File:

PDF, 263 KB

english, 1993

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